Semiconductor Wafer Polishing and Grinding Equipment Market Size Forecast to USD 6.5 Billion by 2035 - Report by TMR

Semiconductor Wafer Polishing and Grinding Equipment Market Valued at USD 2.9 Billion in 2024, Set to Reach USD 6.5 Billion by 2035 – TMR Analysis

WILMINGTON, DE, UNITED STATES, February 26, 2026 /EINPresswire.com/ -- Semiconductor Wafer Polishing and Grinding Equipment Market Outlook 2035

The global semiconductor wafer polishing and grinding equipment market was valued at US$ 2.9 Bn in 2024 and is projected to reach US$ 6.5 Bn by 2035, expanding at a steady CAGR of 4.6% from 2025 to 2035. Market growth is driven by rising semiconductor demand across consumer electronics, automotive, AI, and 5G applications, along with increasing wafer complexity and advanced node manufacturing.

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Analysis of Key Players in the Semiconductor Wafer Polishing and Grinding Equipment Market

The competitive landscape includes specialized semiconductor equipment manufacturers focusing on precision engineering, automation, and process optimization.

Leading companies operating in the global semiconductor wafer polishing and grinding equipment market include:
• Wafer World Inc.
• TOKYO SEIMITSU CO., LTD
• Struers
• Hamamatsu Photonics K.K.
• ATM Qness GmbH
• SHIN NIPPON KOKI CO., LTD.
• GigaMat Technologies
• DISCO Corporation
• Komatsu NTC
• EBARA CORPORATION
• Revasum
• Applied Materials, Inc.
• Okamoto Machine Tool Works,Ltd.
• Logitech Ltd.
• G&N Genauigkeits Maschinenbau Nürnberg GmbH
• Other Prominent Players
These players are investing in advanced CMP systems, automated wafer handling technologies, and high-precision grinding platforms to maintain competitive advantage.

Recent Developments in Semiconductor Wafer Polishing and Grinding Equipment Market
• January 2025: GF Machining Solutions launched the LASER S 500 U, an advanced laser ablation system for silicon carbide (SiC) wafer production. The non-contact, high-precision technology minimizes tool wear, reduces processing time and costs, and enhances edge profiling accuracy through LaserSUITE360 software—supporting efficient and sustainable SiC wafer manufacturing for automotive, energy, and electronics applications.

Key Developments in the Market

• Introduction of next-generation CMP tools for advanced logic and memory devices
• Growing adoption of wafer thinning technologies for 3D packaging
• Expansion of semiconductor manufacturing facilities worldwide
• Increased use of SiC and GaN wafers in power electronics
• Integration of AI-based process monitoring systems

Key Player Strategies

⚙️ Technology Enhancement
Developing high-precision grinding and polishing equipment for advanced nodes.
🏭 Fab Partnerships
Collaborating with semiconductor foundries and IDMs for customized solutions.
🌍 Regional Expansion
Strengthening service and support networks near major semiconductor hubs.
📈 Automation Integration
Enhancing throughput with robotics and intelligent process control systems.
🔬 R&D Investment
Focusing on defect minimization and surface uniformity improvements.

Market Overview

Semiconductor wafer polishing and grinding equipment plays a crucial role in front-end and back-end semiconductor fabrication processes. Grinding equipment is used to thin wafers to the required thickness, while polishing systems—especially Chemical Mechanical Planarization (CMP)—ensure ultra-smooth and defect-free wafer surfaces.

As chip architectures become more compact and multilayered, the need for high-precision wafer surface finishing is growing significantly. Advanced packaging technologies such as 3D stacking, wafer-level packaging (WLP), and system-in-package (SiP) are further increasing demand for sophisticated polishing and grinding solutions.

Expansion of semiconductor fabs globally and increasing investment in domestic chip production are strengthening market prospects.

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Analysts’ Viewpoint on the Global Semiconductor Wafer Polishing and Grinding Equipment Market

Industry analysts anticipate moderate but consistent growth, supported by the evolution of advanced semiconductor nodes and compound semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN).

Asia Pacific dominates the market due to strong semiconductor manufacturing bases in China, Taiwan, South Korea, and Japan. Meanwhile, North America and Europe are experiencing increased investments driven by supply chain localization initiatives.

Technological innovation focused on improving precision, throughput, and defect reduction will remain a key competitive differentiator over the forecast period.

Challenges

• High capital expenditure for semiconductor equipment
• Cyclical semiconductor industry demand
• Technical complexity in advanced wafer processing
• Supply chain disruptions for precision components

Opportunities

📱 Consumer Electronics Growth
Increasing demand for smartphones, tablets, and smart devices.
🚗 Automotive Electrification
Rising need for power semiconductors in EVs.
🌐 5G & AI Applications
Advanced chips requiring ultra-precise wafer finishing.
🏗️ New Semiconductor Fabs
Government-backed domestic chip manufacturing initiatives.
🔋 Compound Semiconductor Expansion
Growth in SiC and GaN wafer processing.

Market Segmentation

➤ By Equipment Type
• Wafer Grinding Equipment
• Wafer Polishing Equipment (CMP Systems)

➤ By Wafer Size
• Up to 200 mm
• 300 mm
• Above 300 mm

➤ By Application
• Memory Devices
• Logic Devices
• Power Devices
• MEMS
• Others

➤ By Region
• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa

Why Invest in the Semiconductor Wafer Polishing and Grinding Equipment Market Outlook 2035

✅ Comprehensive forecast through 2035 across key wafer processing segments
✅ Competitive landscape analysis of major semiconductor equipment manufacturers
✅ Insights into advanced node manufacturing and packaging trends
✅ Regional demand analysis linked to fab expansion initiatives
✅ Identification of growth opportunities in EV, AI, and 5G-driven semiconductor markets

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FAQs

1. What is the projected market size by 2035?
The market is expected to reach US$ 6.5 Bn by 2035.

2. What is the CAGR from 2025–2035?
The market is projected to grow at a CAGR of 4.6%.

3. Which segment dominates the market?
Wafer polishing (CMP) equipment holds a significant share due to its critical role in advanced semiconductor fabrication.

4. Which region leads the market?
Asia Pacific leads due to strong semiconductor manufacturing activities.

5. What are key market trends?
Advanced wafer thinning, compound semiconductor processing, and AI-integrated equipment are shaping the market landscape.

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